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S-2508E Structural Low Viscosity Flooring compound and Injectable Void Filler

Construction:

Flooring Construction and Repair Products
Building and Civil Engineering Adhesives
Adhesives for Architects/Builders

Product Type:

Fillers- potting, moulding, lightweight

Description

Two part epoxy with low viscosity and good flow characteristics. 

S-2508E is designed as a void filler for masonry, concrete and particularly under tiled or laminate floors where gaps have formed.

Uses

Bonding flooring.

filling voids under floors caused by delamination.

Filling voids in concrete and other masonry.

Used as a primer for masonry and plasterboard where S-732UHG is to be used.

Advantages

very low viscosity.

long cure time.

economic use.