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Instant bonding solutions for:
Architects/Builders, Building and Civil
Engineering Contractors, Engineering and
Fabrication, Filter and Electronics, Sign and more

S-251E Structural Low Density Void/Acoustic filler

Engineering & Manufacturing:

Marine Adhesives and Sealants
Engineering and Fabrication Adhesives
Electronic Industry - Adhesives and Potting Compounds

Product Type:

Sealants

Description

 A two part, cold curing epoxy adhesive designed to provide sound deadening properties.

Bonds to metal, wood, GRP; cure slowly and has a high compressive strength.

It is light weight and can assist in situations where acoustic sound deadening is required.

Uses

 

  • Low density void filler with sound deadening properties.

     

  • Used in the Marine Industry as well as the Electronic Industry.

Advantages

Low density.

  • Slow cure.

  • High strength.