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S-211E Structural Two Part Epoxy Potting Compound - Long Cure Cycle

Engineering & Manufacturing:

Engineering and Fabrication Adhesives
Electronic Industry - Adhesives and Potting Compounds

Product Type:

Sealants

Description

A two part epoxy potting compound. The low viscosity and good wetting properties of S–211E Epoxy Potting Compound permit rapid penetration into small gaps and facilitate surface coating. S-211E is formulated to have a very low exotherm even when mixed in bulk quantities.

Uses

Electrical potting. Electronic Industry. Specially designed to encapsulate electronic components and circuitry e.g. coils, transformers and electronic assemblies.

Advantages

Long Cure Cycle.

Low Exotherm.

Low Viscosity.

No outgassing.

Water resistance is good.

Oil, petrol and kerosene resistance is good.

Solvent resistance good to most solvents

Dilute acid and alkali resistance is good.