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S-2673E Structural Epoxy Potting Compound - Short Cure Cycle

Engineering & Manufacturing:

Electronic Industry - Adhesives and Potting Compounds

Product Type:

Sealants

Description

A two part epoxy potting compound for use in electrical potting and encapsulation.

Uses

Used in Electronic Industry . It is specially designed to encapsulate electronic components and circuitry e.g. coils, transformers and electronic assemblies. Electrical potting. It permits rapid penetration into small gaps and facilitates surface coating.

Advantages

Short cure cycle. Low viscosity. Clear or black. Water resistance is good. Oil, petrol and kerosene resistance is good. Solvent resistance is good to most solvents. Dilute acid and Alkali resistance is good Economical.