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S-2355E Structural Epoxy Fast Potting Compound/Plastic Assembly Adhesive

Engineering & Manufacturing:

Engineering and Fabrication Adhesives
Electronic Industry - Adhesives and Potting Compounds

Product Type:

Sealants

Description

Two part rapid set potting compound and plastic assembly adhesive, with a measure of flexibility and impact resistance.

Uses

Used in Electronic Industry for potting of electronics to protect them from movement and tampering. 

Used in plastic assembly as an adesive and also as a sealant.

Bonds dissimilar substrates for example plastics and metals.

Advantages

A tough and flexible when cured.

Rapid cure.

Good compressive strength.

Bonds to a wide variety of substrates.

It stops movement of electronic circuits.

Can be used to ‘tamper proof’ electronic circuits.