Products

S-2673E

S–2673 E Epoxy Potting Compound is a two-part, low viscosity product. S–2673 E has been specially formulated to cure with low exotherm, even when mixed in bulk quantities. The low viscosity and good wetting properties of S–2673 E Epoxy Potting Compound permit rapid penetration into small gaps and facilitate surface coating.  It is specially designed to encapsulate electronic components and circuitry e.g.coils, transformers and electronic assemblies

INSTRUCTIONS
Ensure that the spaces to be filled are dry and dust free.  Mix together 2 parts (by weight) of part 1 with 1 part of part the mixture is so mobile that any air bubbles are quickly lost).  Pour the mixed compound into the space and allow it to cure.
Pot Life Approximately 1-2 hours at normal room temperature.
Cure Time Approximately 1 days at room temperature or 4 hours at 50° C.