Electrical and Electronics Engineering
Structural Adhesives Limited manufacture and sell a range of potting compounds of various cure times and viscosities for potting electrical and electronic components to provide anti-tamper and anti-vibration protection to electronic circuitry and electrical installations. We also manufacture adhesives for bonding electronic components onto circuit boards and adhesives formulated for bonding the magnets onto loudspeakers.
S-211E
Structural Potting Compound. A slow curing potting compound.
S-2673E
Structural Medium to Fast Potting Compound. S 2673 E Epoxy Potting Compound is a two-part, low viscosity product.
S-386E
Resists battery acid and is used to bond ABS and HIPS battery cases.
S-585A / S-85A
Structural Pink and Green Reactive Acrylic Adhesive. A toughened reactive acrylic structural adhesive with a work life of 3 minutes, capable of providing bond strengths of up to 3700 psi (25MPa).

