Electrical and Electronics Engineering

Structural Adhesives Limited manufacture and sell a range of potting compounds of various cure times and viscosities for potting electrical and electronic components to provide anti-tamper and anti-vibration protection to electronic circuitry and electrical installations.  We also manufacture adhesives for bonding electronic components onto circuit boards and adhesives formulated for bonding the magnets onto loudspeakers.


S-211E

Structural Potting Compound. A slow curing potting compound.

S-2673E

Structural Medium to Fast Potting Compound. S 2673 E Epoxy Potting Compound is a two-part, low viscosity product.

S-386E

Resists battery acid and is used to bond ABS and HIPS battery cases.

S-585A / S-85A

Structural Pink and Green Reactive Acrylic Adhesive. A toughened reactive acrylic structural adhesive with a work life of 3 minutes, capable of providing bond strengths of up to 3700 psi (25MPa).

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